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Texas Instruments LDC2112YFDR

INTEGRATED CIRCUIT
part number has RoHS
Manufacturer # :LDC2112YFDR
Manufacturer :Texas Instruments
Dasenic # :LDC2112YFDR-DS
Customer # :
Description : INTEGRATED CIRCUIT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.5300$ 1.53
10+$ 1.4130$ 14.13
100+$ 1.1340$ 113.4
250+$ 1.0710$ 267.75
500+$ 0.9360$ 468
In Stock: 6948
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.53
Total :$ 1.53
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LDC2112YFDR information

  • Texas Instruments LDC2112YFDR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:16-XFBGA, DSBGA
  • Type:Inductance-to-Digital Converter
  • Number of Channels:2
  • Supplier Device Package:16-DSBGA
  • Voltage - Supply:1.71V ~ 1.89V
  • Resolution ( Bits):12 b
  • Sampling Rate ( Per Second):-
  • Data Interface:I²C
  • Voltage Supply Source:Single Supply
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
LDC2112YFDR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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