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Texas Instruments LDC1614RGHR
Manufacturer # :LDC1614RGHR
Manufacturer :Texas Instruments
Dasenic # :LDC1614RGHR-DS
Datasheet : LDC1614RGHR Datasheet
Customer # :
Description : IC IND TO DGT CONV 28BIT 16WQFN
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In Stock: 14139
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.692
Total :$ 1.69
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LDC1614RGHR information
Texas Instruments LDC1614RGHR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:16-WFQFN Exposed Pad
- Type:Inductance-to-Digital Converter
- Number of Channels:4
- Supplier Device Package:16-WQFN (4x4)
- Voltage - Supply:2.7V ~ 3.6V
- Resolution ( Bits):28 b
- Sampling Rate ( Per Second):-
- Data Interface:I²C
- Voltage Supply Source:Single Supply
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LDC1614RGHR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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