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Texas Instruments LDC1101DRCT
Manufacturer # :LDC1101DRCT
Manufacturer :Texas Instruments
Dasenic # :LDC1101DRCT-DS
Datasheet : LDC1101DRCT Datasheet
Customer # :
Description : IC IND TO DGTL 16/24BIT 10VSON
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In Stock: 23378
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.728
Total :$ 1.73
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LDC1101DRCT information
Texas Instruments LDC1101DRCT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - ADCs/DACs - Special Purpose
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:10-VFDFN Exposed Pad
- Type:Inductance-to-Digital Converter
- Number of Channels:2
- Supplier Device Package:10-VSON (3x3)
- Voltage - Supply:1.71V ~ 3.46V
- Resolution ( Bits):16 b, 24 b
- Sampling Rate ( Per Second):150k, 180k
- Data Interface:SPI
- Voltage Supply Source:Single Supply
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LDC1101DRCT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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