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Texas Instruments JM38510/50608BRA
Manufacturer # :JM38510/50608BRA
Manufacturer :Texas Instruments
Dasenic # :JM38510/50608BRA-DS
Datasheet : JM38510/50608BRA Datasheet
Customer # :
Description : Low-Power High-Performance Impact<TM> PAL<R> Circuits
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In Stock: 25
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.646
Total :$ 11.65
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Payment :
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JM38510/50608BRA information
Texas Instruments JM38510/50608BRA technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - PLDs (Programmable Logic Device)
- Product Status:Active
- Mounting Type:Through Hole
- Package / Case:20-CDIP (0.300", 7.62mm)
- Voltage - Input:4.5V ~ 5.5V
- Supplier Device Package:20-CDIP
- Programmable Type:PAL
- Number of Macrocells:4
- Speed:25 ns
- Packaging:Tube
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
JM38510/50608BRA provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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