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Texas Instruments JM38510/32502B2A
Manufacturer # :JM38510/32502B2A
Manufacturer :Texas Instruments
Dasenic # :JM38510/32502B2A-DS
Datasheet : JM38510/32502B2A Datasheet
Customer # :
Description : Octal D-Type Transparent Latches with 3-state Outputs
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In Stock: 1555
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 27.207
Total :$ 27.21
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Texas Instruments JM38510/32502B2A technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Latches
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:20-CLCC
- Output Type:Tri-State, Non-Inverted
- Supplier Device Package:20-LCCC (8.89x8.89)
- Voltage - Supply:4.5V ~ 5V
- Logic Type:D-Type Transparent Latch
- Current - Output High, Low:1mA, 12mA
- Circuit:8:8
- Independent Circuits:1
- Delay Time - Propagation:20ns
- Series:54LS
- Packaging:Tube
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
JM38510/32502B2A provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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