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Texas Instruments JM38510/30106BFA
Manufacturer # :JM38510/30106BFA
Manufacturer :Texas Instruments
Dasenic # :JM38510/30106BFA-DS
Datasheet : JM38510/30106BFA Datasheet
Customer # :
Description : HEX D-TYPE FLIP-FLOPS WITH CLEAR
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In Stock: 77
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.418
Total :$ 5.42
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Payment :
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JM38510/30106BFA information
Texas Instruments JM38510/30106BFA technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-CFlatPack
- Type:D-Type
- Output Type:Non-Inverted
- Functions:Master Reset
- Supplier Device Package:16-CFP
- Number of Elements:1
- Voltage - Supply:4.5V ~ 5.5V
- Clock Frequency:40 MHz
- Number of Bits per Element:6
- Current - Output High, Low:400µA, 4mA
- Max Propagation Delay @ V, Max C L:30ns @ 5V, 15pF
- Current - Quiescent ( Iq):26 mA
- Trigger Type:Positive Edge
- Series:54LS
- Packaging:Tube
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
JM38510/30106BFA provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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