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Texas Instruments IWR6843ARQGALP
SINGLE-CHIP 60-GHZ TO 64-GHZ INT
Manufacturer # :IWR6843ARQGALP
Manufacturer :Texas Instruments
Dasenic # :IWR6843ARQGALP-DS
Datasheet :
IWR6843ARQGALP Datasheet
IWR6843ARQGALP DatasheetCustomer # :
Description : SINGLE-CHIP 60-GHZ TO 64-GHZ INT 180-VFBGA, FCBGA Exposed Pad
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 32.9310 | $ 32.93 |
| 10+ | $ 30.7260 | $ 307.26 |
| 25+ | $ 29.4300 | $ 735.75 |
| 50+ | $ 28.5120 | $ 1425.6 |
| 100+ | $ 27.2070 | $ 2720.7 |
In Stock: 1810
MOQ :1 PCS
Packaging :180-VFBGA, FCBGA Exposed Pad
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 32.931
Total :$ 32.93
Delivery :
Payment :
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IWR6843ARQGALP information
Texas Instruments IWR6843ARQGALP technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C
- Mounting Type:Surface Mount
- Package / Case:180-VFBGA, FCBGA Exposed Pad
- Frequency:60GHz ~ 64GHz
- Type:TxRx + MCU
- Sensitivity:-
- Supplier Device Package:180-FCBGA (15x15)
- Data Rate ( Max):900Mbps
- Memory Size:-
- Voltage - Supply:1.71V ~ 1.89V, 3.13V ~ 3.45V
- Power - Output:15dBm
- Protocol:-
- Serial Interfaces:ADC, GPIO, I²C, SPI
- R F Family/ Standard:-
- Current - Receiving:-
- Modulation:-
- G P I O:48
- Current - Transmitting:-
IWR6843ARQGALP provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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