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Texas Instruments ISO7241MDWG4
DGTL ISO 2500VRMS 4CH GP 16SOIC
Manufacturer # :ISO7241MDWG4
Manufacturer :Texas Instruments
Dasenic # :ISO7241MDWG4-DS
Datasheet :
ISO7241MDWG4 Datasheet
ISO7241MDWG4 DatasheetCustomer # :
Description : DGTL ISO 2500VRMS 4CH GP 16SOIC
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| Quantity | Unit Price | Total |
| 80+ | $ 10.5308 | $ 842.46 |
In Stock: 2418
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.5308
Total :$ 10.53
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ISO7241MDWG4 information
Texas Instruments ISO7241MDWG4 technical specifications, attributes, parameters.
- Category:Isolators/Digital Isolators
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.295", 7.50mm Width)
- Technology:Capacitive Coupling
- Type:General Purpose
- Number of Channels:4
- Supplier Device Package:16-SOIC
- Voltage - Supply:3.15V ~ 5.5V
- Data Rate:150Mbps
- Channel Type:Unidirectional
- Voltage - Isolation:2500Vrms
- Rise / Fall Time ( Typ):2ns, 2ns
- Isolated Power:No
- Inputs - Side 1/ Side 2:3/1
- Common Mode Transient Immunity ( Min):25kV/µs
- Propagation Delay tp L H / tp H L ( Max):23ns, 23ns
- Pulse Width Distortion ( Max):2ns
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ISO7241MDWG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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