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Texas Instruments HPA02230AIDBVR

CURRENT SHUNT MONITOR
part number has RoHS
Manufacturer # :HPA02230AIDBVR
Manufacturer :Texas Instruments
Dasenic # :HPA02230AIDBVR-DS
Customer # :
Description : CURRENT SHUNT MONITOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.5404$ 1.54
10+$ 1.4787$ 14.79
100+$ 1.3863$ 138.63
1000+$ 1.3709$ 1370.9
10000+$ 1.3555$ 13555
In Stock: 34470
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.5404
Total :$ 1.54
Delivery :
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Payment :
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HPA02230AIDBVR information

  • Texas Instruments HPA02230AIDBVR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Current Regulation/Management
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Voltage - Input:-
  • Supplier Device Package:-
  • Current - Output:-
  • Sensing Method:-
  • Accuracy:-
  • Function:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
HPA02230AIDBVR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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