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Texas Instruments HPA01112AIRGTR

HIGH-EFFICIENCY SYNCHRONOUS BUCK
part number has RoHS
Manufacturer # :HPA01112AIRGTR
Manufacturer :Texas Instruments
Dasenic # :HPA01112AIRGTR-DS
Customer # :
Description : HIGH-EFFICIENCY SYNCHRONOUS BUCK
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.5719$ 1.57
10+$ 1.5090$ 15.09
100+$ 1.4147$ 141.47
1000+$ 1.3990$ 1399
10000+$ 1.3832$ 13832
In Stock: 25581
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.5719
Total :$ 1.57
Delivery :
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HPA01112AIRGTR information

  • Texas Instruments HPA01112AIRGTR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Current Regulation/Management
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Voltage - Input:-
  • Supplier Device Package:-
  • Current - Output:-
  • Sensing Method:-
  • Accuracy:-
  • Function:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
HPA01112AIRGTR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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