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Texas Instruments HPA00447PWR
Manufacturer # :HPA00447PWR
Manufacturer :Texas Instruments
Dasenic # :HPA00447PWR-DS
Datasheet : HPA00447PWR Datasheet
Customer # :
Description : POWER SWITCH ICS - POE / LAN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 14292
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.0282
Total :$ 1.03
Delivery :
Payment :
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HPA00447PWR information
Texas Instruments HPA00447PWR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Over Ethernet (PoE) Controllers
- Product Status:Active
- Operating Temperature:-
- Mounting Type:-
- Package / Case:-
- Current - Supply:-
- Type:-
- Power - Max:-
- Number of Channels:-
- Supplier Device Package:-
- Internal Switch(s):-
- Standards:-
- Voltage - Supply:-
- Auxiliary Sense:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HPA00447PWR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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