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Texas Instruments FDC2114RGHR

IC CAPACITIVE SENSING
part number has RoHS
Manufacturer # :FDC2114RGHR
Manufacturer :Texas Instruments
Dasenic # :FDC2114RGHR-DS
Customer # :
Description : IC CAPACITIVE SENSING
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.1140$ 3.11
25+$ 3.0510$ 76.28
100+$ 2.9250$ 292.5
500+$ 2.7990$ 1399.5
1000+$ 2.6460$ 2646
In Stock: 37169
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.114
Total :$ 3.11
Delivery :
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FDC2114RGHR information

  • Texas Instruments FDC2114RGHR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Sensor, Capacitive Touch
  • Product Status:Active
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:16-WFQFN Exposed Pad
  • Current - Supply:2.1mA
  • Type:Proximity Only
  • Interface:I²C
  • Supplier Device Package:16-WQFN (4x4)
  • Resolution:12 b
  • Voltage - Supply:2.7V ~ 3.6V
  • Number of Inputs:4
  • Proximity Detection:Yes
  • L E D Driver Channels:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FDC2114RGHR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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