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Texas Instruments FCT162823ATPACTG4
Manufacturer # :FCT162823ATPACTG4
Manufacturer :Texas Instruments
Dasenic # :FCT162823ATPACTG4-DS
Datasheet : FCT162823ATPACTG4 Datasheet
Customer # :
Description : IC FF D-TYPE DUAL 9BIT 56TSSOP
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In Stock: 5883
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.0269
Total :$ 1.03
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FCT162823ATPACTG4 information
Texas Instruments FCT162823ATPACTG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:56-TFSOP (0.240", 6.10mm Width)
- Type:D-Type
- Output Type:Tri-State, Non-Inverted
- Supplier Device Package:56-TSSOP
- Number of Elements:2
- Voltage - Supply:4.5V ~ 5.5V
- Clock Frequency:-
- Number of Bits per Element:9
- Current - Output High, Low:24mA, 24mA
- Max Propagation Delay @ V, Max C L:20ns @ 5V, 300pF
- Current - Quiescent ( Iq):500 µA
- Trigger Type:Positive Edge
- Input Capacitance:4.5 pF
- Function:Master Reset
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FCT162823ATPACTG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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