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  • Texas Instruments DS90LV110TMTC/NOPB

    IC CLK BUF 1:10 400MHZ 28TSSOP
  • part number has RoHS
  • Mfr.Part # :DS90LV110TMTC/NOPB
  • Manufacturer :Texas Instruments
  • Dasenic # :DS90LV110TMTC/NOPB-DS
  • Datasheet :pdf download DS90LV110TMTC/NOPB Datasheet
  • Description : IC CLK BUF 1:10 400MHZ 28TSSOP
  • Package :-
  • Quantity :
    Unit Price : $ 4.7934Total : $ 4.79
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 4482
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
48 +$ 4.7934$ 230.08
96 +$ 4.4118$ 423.53
528 +$ 4.2408$ 2239.14
1008 +$ 4.0806$ 4113.24

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Texas Instruments DS90LV110TMTC/NOPB technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Clock Buffers, Drivers
Product Status:Active
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:28-TSSOP (0.173", 4.40mm Width)
Type:Fanout Buffer (Distribution)
Supplier Device Package:28-TSSOP
Frequency - Max:400 MHz
Number of Circuits:1
Output:LVDS
Voltage - Supply:3V ~ 3.6V
Input:LVDS, LVPECL, PECL
Ratio - Input: Output:1:10
Differential - Input: Output:Yes/Yes
EU RoHS Status:ROHS3 Compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:5A991B1
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product
DS90LV110TMTC/NOPB provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.

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