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Texas Instruments DS90LV110ATMTX
IC CLK BUF 1:10 200MHZ 28TSSOP
Manufacturer # :DS90LV110ATMTX
Manufacturer :Texas Instruments
Dasenic # :DS90LV110ATMTX-DS
Datasheet :
DS90LV110ATMTX Datasheet
DS90LV110ATMTX DatasheetCustomer # :
Description : IC CLK BUF 1:10 200MHZ 28TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 17.0165 | $ 170.17 |
| 2500+ | $ 9.4536 | $ 23634 |
In Stock: 1657
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 17.0165
Total :$ 17.02
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DS90LV110ATMTX information
Texas Instruments DS90LV110ATMTX technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:28-TSSOP (0.173", 4.40mm Width)
- Type:Fanout Buffer (Distribution)
- Supplier Device Package:28-TSSOP
- Frequency - Max:200 MHz
- Number of Circuits:1
- Output:LVDS
- Voltage - Supply:3V ~ 3.6V
- Input:LVDS, LVPECL, PECL
- Ratio - Input: Output:1:10
- Differential - Input: Output:Yes/Yes
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:5A991B1
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DS90LV110ATMTX provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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