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Texas Instruments DS90LV001TLD/NOPB
Manufacturer # :DS90LV001TLD/NOPB
Manufacturer :Texas Instruments
Dasenic # :DS90LV001TLD/NOPB-DS
Datasheet : DS90LV001TLD/NOPB Datasheet
Customer # :
Description : IC REDRIVER LVDS 1CH 8WSON
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In Stock: 11976
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6975
Total :$ 0.70
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DS90LV001TLD/NOPB information
Texas Instruments DS90LV001TLD/NOPB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Signal Buffers, Repeaters, Splitters
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-WFDFN Exposed Pad
- Current - Supply:47mA
- Type:Buffer, ReDriver
- Number of Channels:1
- Supplier Device Package:8-WSON (3x3)
- Data Rate ( Max):800Mbps
- Output:LVDS
- Voltage - Supply:3V ~ 3.6V
- Input:CML, LVDS, LVPECL
- Delay Time:1.4ns
- Signal Conditioning:-
- Capacitance - Input:-
- Applications:LVDS
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DS90LV001TLD/NOPB provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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