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Texas Instruments DS90CR583MTDX
Manufacturer # :DS90CR583MTDX
Manufacturer :Texas Instruments
Dasenic # :DS90CR583MTDX-DS
Datasheet : DS90CR583MTDX Datasheet
Customer # :
Description : IC INTERFACE SPECIALIZED 56TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 37076
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.828
Total :$ 0.83
Delivery :
Payment :
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DS90CR583MTDX information
Texas Instruments DS90CR583MTDX technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Specialized
- Product Status:Obsolete
- Mounting Type:Surface Mount
- Package / Case:56-TFSOP (0.240", 6.10mm Width)
- Interface:-
- Supplier Device Package:56-TSSOP
- Voltage - Supply:4.5V ~ 5.5V
- Applications:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DS90CR583MTDX provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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