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Texas Instruments DS90C031WRQMLV
Manufacturer # :DS90C031WRQMLV
Manufacturer :Texas Instruments
Dasenic # :DS90C031WRQMLV-DS
Datasheet : DS90C031WRQMLV Datasheet
Customer # :
Description : LVDS quad CMOS differential line driver
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In Stock: 9171
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.3181
Total :$ 7.32
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DS90C031WRQMLV information
Texas Instruments DS90C031WRQMLV technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Drivers, Receivers, Transceivers
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-CFlatPack
- Type:Driver
- Supplier Device Package:16-CFP
- Voltage - Supply:4.5V ~ 5.5V
- Protocol:LVDS
- Number of Drivers/ Receivers:4/0
- Packaging:Tube
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DS90C031WRQMLV provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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