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Texas Instruments DS250DF810ABVT
IC INTFACE SPECIALIZED 135FCBGA
Manufacturer # :DS250DF810ABVT
Manufacturer :Texas Instruments
Dasenic # :DS250DF810ABVT-DS
Datasheet :
DS250DF810ABVT Datasheet
DS250DF810ABVT DatasheetCustomer # :
Description : IC INTFACE SPECIALIZED 135FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 51.8310 | $ 51.83 |
| 10+ | $ 48.6090 | $ 486.09 |
| 25+ | $ 46.5570 | $ 1163.93 |
| 50+ | $ 45.4680 | $ 2273.4 |
| 100+ | $ 43.5870 | $ 4358.7 |
In Stock: 5130
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 51.831
Total :$ 51.83
Delivery :
Payment :
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DS250DF810ABVT information
Texas Instruments DS250DF810ABVT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Specialized
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:135-BGA Module
- Interface:-
- Supplier Device Package:135-FCBGA (13.1x8.1)
- Voltage - Supply:-
- Applications:Retimer
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DS250DF810ABVT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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