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Texas Instruments DRV8332HDDV
Manufacturer # :DRV8332HDDV
Manufacturer :Texas Instruments
Dasenic # :DRV8332HDDV-DS
Datasheet : DRV8332HDDV Datasheet
Customer # :
Description : IC MOTOR DRIVER 44HTSSOP
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In Stock: 1536
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 254.88
Total :$ 254.88
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DRV8332HDDV information
Texas Instruments DRV8332HDDV technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Full, Half-Bridge Drivers
- Product Status:Active
- Operating Temperature:-55°C ~ 175°C (TJ)
- Features:Bootstrap Circuit, Status Flag
- Mounting Type:Surface Mount
- Package / Case:44-TSSOP (0.244", 6.20mm Width) Exposed Pad
- Technology:Power MOSFET
- Interface:PWM
- Supplier Device Package:44-HTSSOP
- Voltage - Supply:10.8V ~ 13.2V
- Current - Output / Channel:5A
- Current - Peak Output:7A
- Fault Protection:Current Limiting, Over Temperature, Short Circuit, UVLO
- Output Configuration:Half Bridge (3)
- Load Type:Inductive
- Rds On ( Typ):260mOhm LS, 260mOhm HS
- Voltage - Load:0V ~ 52.5V
- Applications:DC Motors, General Purpose
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DRV8332HDDV provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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