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Texas Instruments DRV8312DDWR
Manufacturer # :DRV8312DDWR
Manufacturer :Texas Instruments
Dasenic # :DRV8312DDWR-DS
Datasheet : DRV8312DDWR Datasheet
Customer # :
Description : IC BRIDGE DRIVER PAR 44HTSSOP
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In Stock: 39600
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 2.9893
Total :$ 2.99
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DRV8312DDWR information
Texas Instruments DRV8312DDWR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Full, Half-Bridge Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TJ)
- Features:Bootstrap Circuit, Status Flag
- Mounting Type:Surface Mount
- Package / Case:44-TSSOP (0.244", 6.20mm Width) Exposed Pad
- Technology:Power MOSFET
- Interface:PWM
- Supplier Device Package:44-HTSSOP
- Voltage - Supply:10.8V ~ 13.2V
- Current - Output / Channel:3.5A
- Current - Peak Output:6.5A
- Fault Protection:Current Limiting, Over Temperature, Short Circuit, UVLO
- Output Configuration:Half Bridge (3)
- Load Type:Inductive
- Rds On ( Typ):80mOhm LS, 80mOhm HS
- Voltage - Load:0V ~ 52.5V
- Applications:DC Motors, General Purpose
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DRV8312DDWR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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