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Texas Instruments DRV8212DSGR
Manufacturer # :DRV8212DSGR
Manufacturer :Texas Instruments
Dasenic # :DRV8212DSGR-DS
Datasheet : DRV8212DSGR Datasheet
Customer # :
Description : 12-V, 2-A LOW VOLTAGE H-BRIDGE M
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In Stock: 40747
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.666
Total :$ 0.67
Delivery :
Payment :
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DRV8212DSGR information
Texas Instruments DRV8212DSGR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Motor Drivers, Controllers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-WFDFN Exposed Pad
- Technology:NMOS
- Interface:On/Off, PWM
- Supplier Device Package:8-WSON (2x2)
- Voltage - Supply:1.65V ~ 5.5V
- Current - Output:4A
- Output Configuration:Half Bridge (2)
- Voltage - Load:0V ~ 11V
- Motor Type - Stepper:Bipolar
- Motor Type - A C, D C:Brushed DC
- Step Resolution:-
- Applications:Camera
- Function:Driver - Fully Integrated, Control and Power Stage
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DRV8212DSGR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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