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Texas Instruments DRV3256AEPAPRQ1
Manufacturer # :DRV3256AEPAPRQ1
Manufacturer :Texas Instruments
Dasenic # :DRV3256AEPAPRQ1-DS
Datasheet : DRV3256AEPAPRQ1 Datasheet
Customer # :
Description : Integrated 3-phase 48-V automotive Gate Driver Unit (GDU) with 2.5-A peak sink gate drive current
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In Stock: 5001
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.697
Total :$ 5.70
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DRV3256AEPAPRQ1 information
Texas Instruments DRV3256AEPAPRQ1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Motor Drivers, Controllers
- Product Status:Active
- Application:General Purpose
- Package / Case:64-TQFP Exposed Pad
- Technology:NMOS
- Functions:Controller - Current Management
- Interface:SPI
- Series:Automotive, AEC-Q100
- Operating Temperature:-40°C ~ 150°C (TJ)
- Voltage- Supply:20V ~ 90V
- Current- Output:2.5A
- Output Configuration:Half Bridge (3)
- Voltage- Load:20V ~ 90V
- Motor Type- A C D C:Brushless DC (BLDC)
- Motor Type- Stepper:Multiphase
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DRV3256AEPAPRQ1 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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