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Texas Instruments DRA829VMTGBALFRQ1
Manufacturer # :DRA829VMTGBALFRQ1
Manufacturer :Texas Instruments
Dasenic # :DRA829VMTGBALFRQ1-DS
Datasheet : DRA829VMTGBALFRQ1 Datasheet
Customer # :
Description : DUAL ARM CORTEX-A72, QUAD CORTEX
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1507
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 195.9
Total :$ 195.90
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Payment :
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DRA829VMTGBALFRQ1 information
Texas Instruments DRA829VMTGBALFRQ1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - System On Chip (SoC)
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TJ)
- Package / Case:827-BFBGA, FCBGA
- Supplier Device Package:827-FCBGA (24x24)
- Peripherals:DMA, PWM, WDT
- Architecture:DSP, MCU, MPU
- Speed:2GHz, 1GHz, 1.35GHz, 1GHz
- Core Processor:ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
- Flash Size:-
- R A M Size:1.5MB
- Connectivity:I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
- Primary Attributes:-
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:3 (168 Hours,30°C/60%RH)
- US ECCN:5A992C
- HTS US:8542.31.0001
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DRA829VMTGBALFRQ1 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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