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  • Texas Instruments DRA829VMTGBALFR

    DUAL ARM CORTEX-A72, QUAD CORTEX
  • part number has RoHS
  • Mfr.Part # :DRA829VMTGBALFR
  • Manufacturer :Texas Instruments
  • Dasenic # :DRA829VMTGBALFR-DS
  • Datasheet :pdf download DRA829VMTGBALFR Datasheet
  • Description : DUAL ARM CORTEX-A72, QUAD CORTEX
  • Package :-
  • Quantity :
    Unit Price : $ 89.748Total : $ 89.75
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 1738
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 89.7480$ 89.75
10 +$ 79.4250$ 794.25
25 +$ 77.2830$ 1932.08
50 +$ 77.2470$ 3862.35
100 +$ 71.8560$ 7185.60

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Texas Instruments DRA829VMTGBALFR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/System On Chip (SoC)
Product Status:Active
Operating Temperature:-40°C ~ 105°C (TJ)
Package / Case:827-BFBGA, FCBGA
Supplier Device Package:827-FCBGA (24x24)
Peripherals:DMA, PWM, WDT
Architecture:DSP, MCU, MPU
Speed:2GHz, 1GHz, 1.35GHz, 1GHz
Core Processor:ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Flash Size:-
R A M Size:1.5MB
Connectivity:MCAN, MMC/SDSD/IOI²C, SPI, UART, USB
Primary Attributes:-
EU RoHS Status:Vendor omitted MSL Rating information
MSL Rating:3 (168 Hours,30°C/60%RH)
US ECCN:5A992C
HTS US:8542.31.0001
REACH Status:REACH is not affected
China RoHS Status:Green Symbol: Green and environmentally friendly product
DRA829VMTGBALFR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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