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Texas Instruments DP83910AV/NOPB
Manufacturer # :DP83910AV/NOPB
Manufacturer :Texas Instruments
Dasenic # :DP83910AV/NOPB-DS
Datasheet : DP83910AV/NOPB Datasheet
Customer # :
Description : IC INTERFACE SPECIALIZED 28PLCC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 3750
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 21.519
Total :$ 21.52
Delivery :
Payment :
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DP83910AV/NOPB information
Texas Instruments DP83910AV/NOPB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Specialized
- Product Status:Not For New Designs
- Mounting Type:Surface Mount
- Package / Case:28-LCC (J-Lead)
- Interface:Serial
- Supplier Device Package:28-PLCC (11.51x11.51)
- Voltage - Supply:4.75V ~ 5.25V
- Applications:Ethernet Network
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:5A991B1
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DP83910AV/NOPB provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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