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Texas Instruments DBB03AIPMR
IC DGTL BSBND DOLPH CHIP 64LQFP
Manufacturer # :DBB03AIPMR
Manufacturer :Texas Instruments
Dasenic # :DBB03AIPMR-DS
Datasheet :
DBB03AIPMR Datasheet
DBB03AIPMR DatasheetCustomer # :
Description : IC DGTL BSBND DOLPH CHIP 64LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.1247 | $ 2.12 |
| 10+ | $ 2.0045 | $ 20.05 |
| 100+ | $ 1.8910 | $ 189.1 |
| 1000+ | $ 1.7840 | $ 1784 |
| 10000+ | $ 1.6830 | $ 16830 |
In Stock: 20316
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.1247
Total :$ 2.12
Delivery :
Payment :
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DBB03AIPMR information
Texas Instruments DBB03AIPMR technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Misc ICs and Modules
- Product Status:Obsolete
- Mounting Type:Surface Mount
- Package / Case:64-LQFP
- Frequency:-
- Supplier Device Package:64-LQFP (10x10)
- R F Type:-
- Secondary Attributes:Baseband ASIC for Dolphin Chipset
- Function:Baseband ASIC for Dolphin Chipset
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DBB03AIPMR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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