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Texas Instruments DAC8741HRGET

IC INTERFACE SPECIALIZED 24VQFN
part number has RoHS
Manufacturer # :DAC8741HRGET
Manufacturer :Texas Instruments
Dasenic # :DAC8741HRGET-DS
Customer # :
Description : IC INTERFACE SPECIALIZED 24VQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 5.3784$ 53.78
250+$ 4.4820$ 1120.5
In Stock: 5178
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.3784
Total :$ 5.38
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DAC8741HRGET information

  • Texas Instruments DAC8741HRGET technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Specialized
  • Product Status:Active
  • Mounting Type:Surface Mount
  • Package / Case:24-VFQFN Exposed Pad
  • Interface:SPI
  • Supplier Device Package:24-VQFN (4x4)
  • Voltage - Supply:1.71V ~ 5.5V, 2.7V ~ 5.5V
  • Applications:HART Modem
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:2 (1 Year,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DAC8741HRGET provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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