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Texas Instruments DAC712UB

IC DAC 16BIT V-OUT 28SOIC
part number has RoHS
Manufacturer # :DAC712UB
Manufacturer :Texas Instruments
Dasenic # :DAC712UB-DS
Customer # :
Description : IC DAC 16BIT V-OUT 28SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 235.7160$ 235.72
2+$ 227.8580$ 455.72
3+$ 204.2860$ 612.86
In Stock: 1513
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 235.716
Total :$ 235.72
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DAC712UB information

  • Texas Instruments DAC712UB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Data Acquisition - Digital to Analog Converters (DAC)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:28-SOIC (0.295", 7.50mm Width)
  • Output Type:Voltage - Buffered
  • Supplier Device Package:28-SOIC
  • Data Interface:Parallel
  • Number of Bits:16
  • Voltage - Supply, Analog:±11.4V ~ 16.5V
  • Voltage - Supply, Digital:-
  • Architecture:R-2R
  • Reference Type:Internal
  • Number of D/ A Converters:1
  • Settling Time:10µs
  • Differential Output:No
  • I N L/ D N L ( L S B):±4 (Max), ±4 (Max)
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
DAC712UB provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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