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Texas Instruments DAC5652IPFB
Manufacturer # :DAC5652IPFB
Manufacturer :Texas Instruments
Dasenic # :DAC5652IPFB-DS
Datasheet : DAC5652IPFB Datasheet
Customer # :
Description : Dual-Channel, 10-Bit, 275-MSPS Digital-to-Analog Converter (DAC)
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In Stock: 14785
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.835
Total :$ 11.84
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DAC5652IPFB information
Texas Instruments DAC5652IPFB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Digital to Analog Converters (DAC)
- Product Status:Active
- Package / Case:48-TQFP
- Supplier Device Package:48-TQFP (7x7)
- Architecture:Current Source
- Operating Temperature:-40°C ~ 85°C
- Data Interface:Parallel
- Numberof Bits:10
- Voltage- Supply Analog:3V ~ 3.6V
- Voltage- Supply Digital:3V ~ 3.6V
- Reference Type:External, Internal
- Output Type:Current - Unbuffered
- I N L/ D N L( L S B):±0.25, ±0.16
- Settling Time:20ns (Typ)
- Differential Output:Yes
- Numberof D/ A Converters:2
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DAC5652IPFB provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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