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Texas Instruments DAC5311IDCKT
IC DAC 8BIT V-OUT SC70-6
Manufacturer # :DAC5311IDCKT
Manufacturer :Texas Instruments
Dasenic # :DAC5311IDCKT-DS
Datasheet :
DAC5311IDCKT Datasheet
DAC5311IDCKT DatasheetCustomer # :
Description : IC DAC 8BIT V-OUT SC70-6
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| Quantity | Unit Price | Total |
| 7+ | $ 0.6289 | $ 4.4 |
In Stock: 49625
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.6289
Total :$ 0.63
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DAC5311IDCKT information
Texas Instruments DAC5311IDCKT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Digital to Analog Converters (DAC)
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:6-TSSOP, SC-88, SOT-363
- Output Type:Voltage - Buffered
- Supplier Device Package:SC-70-6
- Data Interface:SPI, DSP
- Number of Bits:8
- Voltage - Supply, Analog:2V ~ 5.5V
- Voltage - Supply, Digital:2V ~ 5.5V
- Architecture:String DAC
- Reference Type:Supply
- Number of D/ A Converters:1
- Settling Time:12µs (Typ)
- Differential Output:No
- I N L/ D N L ( L S B):±0.01, ±0.01
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
DAC5311IDCKT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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