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Texas Instruments CY74FCT2374ATSOCG4
Manufacturer # :CY74FCT2374ATSOCG4
Manufacturer :Texas Instruments
Dasenic # :CY74FCT2374ATSOCG4-DS
Datasheet : CY74FCT2374ATSOCG4 Datasheet
Customer # :
Description : IC FF D-TYPE SNGL 8BIT 20SOIC
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In Stock: 1043
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.9801
Total :$ 0.98
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CY74FCT2374ATSOCG4 information
Texas Instruments CY74FCT2374ATSOCG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:20-SOIC (0.295", 7.50mm Width)
- Type:D-Type
- Output Type:Tri-State, Non-Inverted
- Supplier Device Package:20-SOIC
- Number of Elements:1
- Voltage - Supply:4.75V ~ 5.25V
- Clock Frequency:250 MHz
- Number of Bits per Element:8
- Current - Output High, Low:15mA, 12mA
- Max Propagation Delay @ V, Max C L:6.5ns @ 5V, 50pF
- Current - Quiescent ( Iq):200 µA
- Trigger Type:Positive Edge
- Input Capacitance:5 pF
- Function:Standard
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CY74FCT2374ATSOCG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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