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Texas Instruments CSD97370AQ5M
Manufacturer # :CSD97370AQ5M
Manufacturer :Texas Instruments
Dasenic # :CSD97370AQ5M-DS
Datasheet : CSD97370AQ5M Datasheet
Customer # :
Description : IC SYNC BUCK NEXFET 22SON
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 16229
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.476
Total :$ 1.48
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Payment :
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CSD97370AQ5M information
Texas Instruments CSD97370AQ5M technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Full, Half-Bridge Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TJ)
- Features:Bootstrap Circuit
- Mounting Type:Surface Mount
- Package / Case:22-PowerLFDFN
- Technology:Power MOSFET
- Interface:PWM
- Supplier Device Package:22-LSON-CLIP (6x5)
- Voltage - Supply:4.5V ~ 5.5V
- Current - Output / Channel:40A
- Current - Peak Output:60A
- Fault Protection:Shoot-Through, UVLO
- Output Configuration:Half Bridge
- Load Type:Inductive
- Rds On ( Typ):-
- Voltage - Load:3.3V ~ 22V
- Applications:Synchronous Buck Converters
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CSD97370AQ5M provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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