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Texas Instruments CSD95410RRBT
Manufacturer # :CSD95410RRBT
Manufacturer :Texas Instruments
Dasenic # :CSD95410RRBT-DS
Datasheet : CSD95410RRBT Datasheet
Customer # :
Description : 90-A peak continuous synchronous buck NexFET™ smart power stage
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In Stock: 3210
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.282
Total :$ 6.28
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CSD95410RRBT information
Texas Instruments CSD95410RRBT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Full, Half-Bridge Drivers
- Product Status:Active
- Features:Bootstrap Circuit, Diode Emulation
- Application:Synchronous Buck Converters, Voltage Regulators
- Package / Case:41-PowerTFQFN
- Technology:Power MOSFET
- Series:NexFET™
- Operating Temperature:-40°C ~ 125°C (TA)
- Fault Protection:Shoot-Through
- Load Type:Inductive
- Current- Peak Output:80A
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CSD95410RRBT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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