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Texas Instruments CSD87501L
Manufacturer # :CSD87501L
Manufacturer :Texas Instruments
Dasenic # :CSD87501L-DS
Datasheet : CSD87501L Datasheet
Customer # :
Description : MOSFET 2N-CH 30V 10PICOSTAR
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In Stock: 49969
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3188
Total :$ 0.32
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CSD87501L information
Texas Instruments CSD87501L technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Arrays
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:10-XFLGA
- Power - Max:2.5W
- Supplier Device Package:10-Picostar (3.37x1.47)
- F E T Type:2 N-Channel (Dual) Common Drain
- F E T Feature:Logic Level Gate
- Drain to Source Voltage ( Vdss):-
- Current - Continuous Drain ( Id) @ 25° C:-
- Rds On ( Max) @ Id, Vgs:-
- Vgs(th) ( Max) @ Id:2.3V @ 250µA
- Gate Charge ( Qg) ( Max) @ Vgs:40nC @ 10V
- Input Capacitance ( Ciss) ( Max) @ Vds:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CSD87501L provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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