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  • Texas Instruments CSD87333Q3DT

    MOSFET 2N-CH 30V 15A 8VSON
  • part number has RoHS
  • Mfr.Part # :CSD87333Q3DT
  • Manufacturer :Texas Instruments
  • Dasenic # :CSD87333Q3DT-DS
  • Datasheet :pdf download CSD87333Q3DT Datasheet
  • Description : MOSFET 2N-CH 30V 15A 8VSON
  • Package :-
  • Quantity :
    Unit Price : $ 0.0971Total : $ 0.10
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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In Stock: 1988
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
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1 +$ 0.0971$ 0.10

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Texas Instruments CSD87333Q3DT technical specifications, attributes, parameters.
Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Arrays
Product Status:Active
Operating Temperature:125°C (TJ)
Mounting Type:Surface Mount
Package / Case:8-PowerTDFN
Power - Max:6W
Supplier Device Package:8-VSON (3.3x3.3)
F E T Type:2 N-Channel (Dual) Asymmetrical
F E T Feature:Logic Level Gate, 5V Drive
Drain to Source Voltage ( Vdss):30V
Current - Continuous Drain ( Id) @ 25° C:15A
Rds On ( Max) @ Id, Vgs:14.3mOhm @ 4A, 8V
Vgs(th) ( Max) @ Id:1.2V @ 250µA
Gate Charge ( Qg) ( Max) @ Vgs:4.6nC @ 4.5V
Input Capacitance ( Ciss) ( Max) @ Vds:662pF @ 15V
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
CSD87333Q3DT provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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