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Texas Instruments CSD13383F4T
MOSFET N-CH 12V 2.9A 3PICOSTAR
Manufacturer # :CSD13383F4T
Manufacturer :Texas Instruments
Dasenic # :CSD13383F4T-DS
Datasheet :
CSD13383F4T Datasheet
CSD13383F4T DatasheetCustomer # :
Description : MOSFET N-CH 12V 2.9A 3PICOSTAR
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| Quantity | Unit Price | Total |
| 18+ | $ 0.2263 | $ 4.07 |
In Stock: 12876
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.2263
Total :$ 0.23
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CSD13383F4T information
Texas Instruments CSD13383F4T technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:3-XFDFN
- Technology:MOSFET (Metal Oxide)
- Supplier Device Package:3-PICOSTAR
- Power Dissipation ( Max):500mW (Ta)
- F E T Type:N-Channel
- F E T Feature:-
- Drain to Source Voltage ( Vdss):12 V
- Current - Continuous Drain ( Id) @ 25° C:2.9A (Ta)
- Rds On ( Max) @ Id, Vgs:44mOhm @ 500mA, 4.5V
- Vgs(th) ( Max) @ Id:1.25V @ 250µA
- Gate Charge ( Qg) ( Max) @ Vgs:2.6 nC @ 4.5 V
- Input Capacitance ( Ciss) ( Max) @ Vds:291 pF @ 6 V
- Drive Voltage ( Max Rds On, Min Rds On):2.5V, 4.5V
- Vgs ( Max):±10V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.21.0095
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CSD13383F4T provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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