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Texas Instruments CDCR61APWRG4
Manufacturer # :CDCR61APWRG4
Manufacturer :Texas Instruments
Dasenic # :CDCR61APWRG4-DS
Datasheet : CDCR61APWRG4 Datasheet
Customer # :
Description : IC DIRECT RAMBUS CLK GEN 16TSSOP
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In Stock: 1819
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.2723
Total :$ 9.27
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CDCR61APWRG4 information
Texas Instruments CDCR61APWRG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Application Specific
- Product Status:Active
- Operating Temperature:0°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package:16-TSSOP
- Frequency - Max:400MHz
- Number of Circuits:1
- Output:LVCMOS
- Voltage - Supply:3V ~ 3.6V
- P L L:Yes
- Input:Crystal
- Ratio - Input: Output:1:2
- Differential - Input: Output:No/Yes
- Main Purpose:Memory, RDRAM
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CDCR61APWRG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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