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Texas Instruments CDCLVD1212RHAT
Manufacturer # :CDCLVD1212RHAT
Manufacturer :Texas Instruments
Dasenic # :CDCLVD1212RHAT-DS
Datasheet : CDCLVD1212RHAT Datasheet
Customer # :
Description : IC CLK BUFFER 2:12 800MHZ 40VQFN
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In Stock: 11400
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.631
Total :$ 8.63
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CDCLVD1212RHAT information
Texas Instruments CDCLVD1212RHAT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:40-VFQFN Exposed Pad
- Type:Fanout Buffer (Distribution), Multiplexer
- Supplier Device Package:40-VQFN (6x6)
- Frequency - Max:800 MHz
- Number of Circuits:1
- Output:LVDS
- Voltage - Supply:2.375V ~ 2.625V
- Input:LVCMOS, LVDS, LVPECL
- Ratio - Input: Output:2:12
- Differential - Input: Output:Yes/Yes
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CDCLVD1212RHAT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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