Name: CDC391DG4
Brand: Texas Instruments
SKU: DS-7262540
Price: 17.4998 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Texas Instruments CDC391DG4

IC CLK BUFFER 1:6 100MHZ 16SOIC

Manufacturer # :CDC391DG4

Manufacturer :Texas Instruments

Dasenic # :CDC391DG4-DS

Datasheet :

CDC391DG4 Datasheet

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Description : IC CLK BUFFER 1:6 100MHZ 16SOIC

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Quantity	Unit Price	Total
80+	$ 17.4998	$ 1399.98

In Stock: 505

MOQ :1 PCS

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Shipping Origin :Shenzhen or Hong Kong Warehouse

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Unit Price :$ 17.4998

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CDC391DG4 information

Texas Instruments CDC391DG4 technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
Product Status:Active
Operating Temperature:-40°C ~ 85°C
Mounting Type:Surface Mount
Package / Case:16-SOIC (0.154", 3.90mm Width)
Type:Fanout Buffer (Distribution)
Supplier Device Package:16-SOIC
Frequency - Max:100 MHz
Number of Circuits:1
Output:TTL
Voltage - Supply:4.75V ~ 5.25V
Input:TTL
Ratio - Input: Output:1:6
Differential - Input: Output:No/No
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Texas Instruments CDC391DG4
Datasheet:
CDC391DG4,

Texas Instruments CDC391DG4 Environmental and export classification status description
Texas Instruments CDC391DG4 Overview The Texas Instruments CDC391DG4 is a high-performance, low-skew, low-jitter clock driver/divider IC designed for applications requiring high-speed, low-voltage, and low-current operation. This IC supports clock distribution and fanout buffering in timing and clocking systems. Functions - Clock distribution and buffering - Low-skew, low-jitter clock outputs Applications - Telecom and networking equipment - High-performance computing systems - Test and measurement instruments - Data communication devices Alternative Components - Intel CY2305SZC - IDT 5P1109 Embedded Modules - Clock management - Fanout buffering Related Q&A 1. What is the maximum frequency the Texas Instruments CDC391DG4 can support? - The CDC391DG4 can support clock frequencies up to 1 GHz, making it suitable for high-speed applications. 2. Can the CDC391DG4 be cascaded to drive multiple clock domains? - Yes, multiple CDC391DG4 devices can be cascaded to drive and distribute clocks across multiple clock domains with low skew. 3. How does the CDC391DG4 help reduce jitter in clock distribution systems? - The CDC391DG4 incorporates low-jitter PLL (Phase-Locked Loop) and distribution technology to minimize clock jitter for high-performance applications. 4. What is the typical power consumption of the Texas Instruments CDC391DG4 in operation? - The CDC391DG4 has a low-power consumption design and typically operates at a power consumption of around 100mW. 5. Can the CDC391DG4 be used in automotive applications that require high reliability and performance? - The Texas Instruments CDC391DG4 meets automotive-grade requirements and can be used in demanding automotive electronic systems that demand high reliability and performance.

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CDC391DG4 provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.