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Texas Instruments CDC2351DWR

IC CLK BUFFER 1:10 100MHZ 24SOIC
part number has RoHS
Manufacturer # :CDC2351DWR
Manufacturer :Texas Instruments
Dasenic # :CDC2351DWR-DS
Customer # :
Description : IC CLK BUFFER 1:10 100MHZ 24SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 7.1820$ 7.18
25+$ 7.0380$ 175.95
100+$ 6.7500$ 675
500+$ 6.4620$ 3231
1000+$ 6.1020$ 6102
In Stock: 18769
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.182
Total :$ 7.18
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CDC2351DWR information

  • Texas Instruments CDC2351DWR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:24-SOIC (0.295", 7.50mm Width)
  • Type:Fanout Buffer (Distribution)
  • Supplier Device Package:24-SOIC
  • Frequency - Max:100 MHz
  • Number of Circuits:1
  • Output:LVTTL
  • Voltage - Supply:3V ~ 3.6V
  • Input:LVTTL
  • Ratio - Input: Output:1:10
  • Differential - Input: Output:No/No
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CDC2351DWR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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