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Texas Instruments CD74HCT40105M96
Manufacturer # :CD74HCT40105M96
Manufacturer :Texas Instruments
Dasenic # :CD74HCT40105M96-DS
Datasheet : CD74HCT40105M96 Datasheet
Customer # :
Description : IC FIFO REGISTER 4X16 16SOIC
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In Stock: 13800
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3413
Total :$ 0.34
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CD74HCT40105M96 information
Texas Instruments CD74HCT40105M96 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package:16-SOIC
- Memory Size:64 (16 x 4)
- Voltage - Supply:4.5 V ~ 5.5 V
- Current - Supply ( Max):-
- Data Rate:-
- Access Time:-
- Bus Directional:Uni-Directional
- Expansion Type:Depth, Width
- Programmable Flags Support:No
- Retransmit Capability:No
- F W F T Support:No
- Function:Asynchronous
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CD74HCT40105M96 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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