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Texas Instruments CD74HC541E

IC BUFFER NON-INVERT 6V 20DIP
part number has RoHS
Manufacturer # :CD74HC541E
Manufacturer :Texas Instruments
Dasenic # :CD74HC541E-DS
Customer # :
Description : IC BUFFER NON-INVERT 6V 20DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.4464$ 0.45
10+$ 0.3114$ 3.11
50+$ 0.3105$ 15.53
200+$ 0.3096$ 61.92
500+$ 0.3060$ 153
In Stock: 8097
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4464
Total :$ 0.45
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CD74HC541E information

  • Texas Instruments CD74HC541E technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Buffers, Drivers, Receivers, Transceivers
  • Product Status:Active
  • Operating Temperature:-55°C ~ 125°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:20-DIP (0.300", 7.62mm)
  • Input Type:-
  • Output Type:3-State
  • Supplier Device Package:20-PDIP
  • Number of Elements:1
  • Voltage - Supply:2V ~ 6V
  • Logic Type:Buffer, Non-Inverting
  • Number of Bits per Element:8
  • Current - Output High, Low:7.8mA, 7.8mA
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:Vendor omitted MSL Rating information
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CD74HC541E provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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