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  • Texas Instruments CD74HC377PWR

    IC FF D-TYPE SNGL 8BIT 20TSSOP
  • part number has RoHS
  • Mfr.Part # :CD74HC377PWR
  • Manufacturer :Texas Instruments
  • Dasenic # :CD74HC377PWR-DS
  • Datasheet :pdf download CD74HC377PWR Datasheet
  • Description : IC FF D-TYPE SNGL 8BIT 20TSSOP
  • Package :-
  • Quantity :
    Unit Price : $ 0.54Total : $ 0.54
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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In Stock: 7146
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.5400$ 0.54
10 +$ 0.3402$ 3.40
100 +$ 0.2754$ 27.54
500 +$ 0.2637$ 131.85
1000 +$ 0.2529$ 252.90

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Texas Instruments CD74HC377PWR technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Flip Flops
Product Status:Active
Operating Temperature:-55°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:20-TSSOP (0.173", 4.40mm Width)
Type:D-Type
Output Type:Non-Inverted
Supplier Device Package:20-TSSOP
Number of Elements:1
Voltage - Supply:2V ~ 6V
Clock Frequency:60 MHz
Number of Bits per Element:8
Current - Output High, Low:5.2mA, 5.2mA
Max Propagation Delay @ V, Max C L:30ns @ 6V, 50pF
Current - Quiescent ( Iq):8 µA
Trigger Type:Positive Edge
Input Capacitance:10 pF
Function:Standard
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.39.0001
China RoHS Status:Green Symbol: Green and environmentally friendly product
CD74HC377PWR provided by Texas Instruments

Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.

TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.

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