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Texas Instruments CD4086BNSR
Manufacturer # :CD4086BNSR
Manufacturer :Texas Instruments
Dasenic # :CD4086BNSR-DS
Datasheet : CD4086BNSR Datasheet
Customer # :
Description : IC EXPND AND-ORINV GATE 14SO
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In Stock: 16800
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.663
Total :$ 0.66
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CD4086BNSR information
Texas Instruments CD4086BNSR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Gates and Inverters - Multi-Function, Configurable
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:14-SOIC (0.209", 5.30mm Width)
- Output Type:Single-Ended
- Supplier Device Package:14-SO
- Number of Circuits:1
- Voltage - Supply:3V ~ 18V
- Number of Inputs:8 Input (2, 2, 2, 2)
- Logic Type:AND/OR/INVERT Gate
- Current - Output High, Low:6.8mA, 6.8mA
- Schmitt Trigger Input:No
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CD4086BNSR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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