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Texas Instruments CD4067BEG4
Manufacturer # :CD4067BEG4
Manufacturer :Texas Instruments
Dasenic # :CD4067BEG4-DS
Datasheet : CD4067BEG4 Datasheet
Customer # :
Description : IC MUX/DEMUX 1X16 24DIP
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In Stock: 66
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
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CD4067BEG4 information
Texas Instruments CD4067BEG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches, Multiplexers, Demultiplexers
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C (TA)
- Mounting Type:Through Hole
- Package / Case:24-DIP (0.600", 15.24mm)
- Supplier Device Package:24-PDIP
- Number of Circuits:1
- Multiplexer/ Demultiplexer Circuit:16:1
- Switch Circuit:-
- On- State Resistance ( Max):240Ohm
- Voltage - Supply, Single ( V+):3V ~ 18V
- Voltage - Supply, Dual ( V±):-
- -3db Bandwidth:14MHz
- Channel-to- Channel Matching (Δ Ron):5Ohm
- Switch Time ( Ton, Toff) ( Max):-
- Charge Injection:-
- Channel Capacitance ( C S(off), C D(off)):0.2pF, 55pF
- Current - Leakage ( I S(off)) ( Max):100nA
- Crosstalk:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CD4067BEG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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