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Texas Instruments CD4011BM96
Manufacturer # :CD4011BM96
Manufacturer :Texas Instruments
Dasenic # :CD4011BM96-DS
Datasheet : CD4011BM96 Datasheet
Customer # :
Description : IC GATE NAND 4CH 2-INP 14SOIC
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In Stock: 23505
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.1415
Total :$ 0.14
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CD4011BM96 information
Texas Instruments CD4011BM96 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Gates and Inverters
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package:14-SOIC
- Number of Circuits:4
- Voltage - Supply:3V ~ 18V
- Number of Inputs:2
- Current - Quiescent ( Max):1 µA
- Logic Type:NAND Gate
- Current - Output High, Low:3.4mA, 3.4mA
- Max Propagation Delay @ V, Max C L:90ns @ 15V, 50pF
- Logic Level - Low:1.5V ~ 4V
- Logic Level - High:3.5V ~ 11V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD4011BM96 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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