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Texas Instruments CD40105BF3A

CMOS 4-Bit-by-16-Word FIFO Register
part number has RoHS
Manufacturer # :CD40105BF3A
Manufacturer :Texas Instruments
Dasenic # :CD40105BF3A-DS
Customer # :
Description : CMOS 4-Bit-by-16-Word FIFO Register
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 11.7000$ 11.7
5+$ 8.7750$ 43.88
In Stock: 8470
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.7
Total :$ 11.70
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CD40105BF3A information

  • Texas Instruments CD40105BF3A technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
  • Product Status:Active
  • Operating Temperature:-55°C ~ 125°C
  • Mounting Type:Through Hole
  • Package / Case:16-CDIP (0.300", 7.62mm)
  • Functions:Asynchronous
  • Supplier Device Package:16-CDIP
  • Memory Size:64 (16 x 4)
  • Voltage - Supply:3 V ~ 18 V
  • Current - Supply ( Max):100µA
  • Data Rate:8MHz
  • Bus Directional:Uni-Directional
  • Expansion Type:Depth, Width
  • Programmable Flags Support:No
  • Retransmit Capability:No
  • F W F T Support:No
  • Series:4000B
  • Packaging:Tube
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CD40105BF3A provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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