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Texas Instruments CCBT16245IDGGRQ1G4

PROTOTYPE
part number has RoHS
Manufacturer # :CCBT16245IDGGRQ1G4
Manufacturer :Texas Instruments
Dasenic # :CCBT16245IDGGRQ1G4-DS
Customer # :
Description : PROTOTYPE
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QuantityUnit PriceTotal
In Stock: 2464
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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CCBT16245IDGGRQ1G4 information

  • Texas Instruments CCBT16245IDGGRQ1G4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:48-TFSOP (0.240", 6.10mm Width)
  • Type:Bus Switch
  • Supplier Device Package:48-TSSOP
  • Voltage - Supply:4V ~ 5.5V
  • Voltage Supply Source:Single Supply
  • Circuit:8 x 1:1
  • Independent Circuits:2
  • Series:74CBT
  • Packaging:Bulk
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CCBT16245IDGGRQ1G4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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