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Texas Instruments CC430F6137IRGC
Manufacturer # :CC430F6137IRGC
Manufacturer :Texas Instruments
Dasenic # :CC430F6137IRGC-DS
Datasheet : CC430F6137IRGC Datasheet
Customer # :
Description : IC RF TXRX+MCU ISM<1GHZ 64VFQFN
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In Stock: 8640
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 23.5746
Total :$ 23.57
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CC430F6137IRGC information
Texas Instruments CC430F6137IRGC technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Discontinued at Digi-Key
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:64-VFQFN Exposed Pad
- Frequency:300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz
- Type:TxRx + MCU
- Sensitivity:-117dBm
- Supplier Device Package:64-VQFN (9x9)
- Data Rate ( Max):500kBaud
- Memory Size:32kB Flash, 4kB SRAM
- Voltage - Supply:2V ~ 3.6V
- Power - Output:13dBm
- Protocol:-
- Serial Interfaces:I²C, IrDA, JTAG, SPI, UART
- R F Family/ Standard:General ISM < 1GHz
- Current - Receiving:15mA ~ 18.5mA
- Modulation:2FSK, 2GFSK, ASK, MSK, OOK
- G P I O:44
- Current - Transmitting:15mA ~ 36mA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:5A002A1 TI
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CC430F6137IRGC provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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